• DocumentCode
    2291124
  • Title

    PD-SOI MOSFETs: interface effect on point defects and doping profiles

  • Author

    Bazizi, E.M. ; Pakfar, A. ; Fazzini, P.F. ; Cristiano, F. ; Tavernier, C. ; Claverie, A. ; Burenkov, A. ; Pichler, P.

  • Author_Institution
    STMicroelectronics, Crolles, France
  • fYear
    2009
  • fDate
    5-8 Oct. 2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this work, the influence of the Silicon/Buried Oxide interface (Si/BOX) on the electrical characteristics of silicon-on-insulator (SOI) MOSFETs is investigated by means of numerical simulations. Considering the State-of-Art dopant diffusion models and the recombining effect of Si/BOX interface on point defect, process simulations were performed to investigate the two-dimensional diffusion behaviour of the dopant impurities. The impact of the Si/BOX is investigated by analyzing the standard electrical characteristics of CMOS devices. Finally, a new electrical characterization methodology is detailed to better analyze dopants lateral diffusion profiles.
  • Keywords
    CMOS integrated circuits; MOSFET; buried layers; diffusion; doping profiles; impurities; numerical analysis; point defects; semiconductor process modelling; silicon-on-insulator; CMOS devices; PD-SOI MOSFET; dopant diffusion models; dopant impurities; doping profiles; interface effect; lateral diffusion profiles; numerical simulations; point defects; process simulations; recombining effect; silicon-buried oxide interface; silicon-on-insulator; two-dimensional diffusion; Atomic measurements; Doping profiles; Electric variables; Electric variables measurement; MOS devices; MOSFETs; Semiconductor device modeling; Semiconductor process modeling; Silicon on insulator technology; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2009 IEEE International
  • Conference_Location
    Foster City, CA
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4244-4256-0
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2009.5318743
  • Filename
    5318743