Title :
A feature oriented approach to modeling and reusing requirements of software product lines
Author :
Mei, Hong ; Zhang, Wei ; Gu, Fang
Author_Institution :
Inst. of Software, Peking Univ., Beijing, China
Abstract :
Getting a proper set of reusable requirements is an important milestone for successful software product line (SPL) practice. But modeling SPL requirements is usually more complex and difficult than modeling requirements for individual applications because it often involves systematically exploring commonality and variation across a set of applications. This paper presents a feature-oriented approach to modeling and reusing SPL requirements. A framework of the feature model is first proposed from five aspects, namely, basic structure, variation representation mechanism, variation binding time, variation constraint mechanism and quality feature analysis. Then, a customization-based reusing method is suggested, and a feature-oriented domain modeling method (FODM) is presented, including a concrete form of the feature model and a modeling process for it. At the end, a case study of a real domain is used to validate the feature model framework and demonstrate FODM.
Keywords :
formal specification; product development; software quality; software reusability; systems analysis; FODM; SPL practice; SPL requirements; basic structure; customization-based reusing; domain analysis; domain engineering; feature oriented approach; feature-oriented domain modeling; modeling requirements; quality feature analysis; software product line; software product lines; software requirements; software reuse; variation binding time; variation constraint mechanism; variation representation mechanism; Application software; Asset management; Computer science; Concrete; Design for manufacture; Production; Productivity; Software quality; Software reusability; Time factors;
Conference_Titel :
Computer Software and Applications Conference, 2003. COMPSAC 2003. Proceedings. 27th Annual International
Print_ISBN :
0-7695-2020-0
DOI :
10.1109/CMPSAC.2003.1245350