DocumentCode
229781
Title
Analyze and improve lifetime in 3L-NPC inverter from power cycle and thermal balance
Author
Quan Chen ; Zhe Chen ; Qunjing Wang ; Guoli Li ; Long Cheng
Author_Institution
Eng. Res. Center of Power Quality, Anhui Univ., Hefei, China
fYear
2014
fDate
22-25 Oct. 2014
Firstpage
974
Lastpage
980
Abstract
Three-level Neutral-point-clamped (3L-NPC) topology is becoming a realistic alternative to the conventional one in high-voltage and high-power application. Studies show that the power cycling mean time to failure (MTTF) of the semiconductor bond wire in 3L-NPC inverter system may be very short under some common conditions. Firstly, this paper shows the impact of some key parameters on power electronic system lifetime according the analysis of semiconductor failure mechanism. Secondly, a switching frequency reduction method based on the position relationship between the flowing current and load voltage is applied to reduce power cycle and switching losses. And then, three-level active neutral-point-clamped topology is taken into account to wake the most thermo stressed device. In order to validate the improve lifetime method in this paper, a 2 MW 3L-NPC converter used in wind energy has been simulated. Finally, the described method has been tested in a 7.5 kVA scalable prototype.
Keywords
clamps; invertors; network topology; power semiconductor devices; power system reliability; wind power; 3L-NPC inverter; MTTF; apparent power 7.5 kVA; power 2 MW; power cycle reduction; power cycling mean time to failure; power electronic system lifetime improvement; semiconductor bond wire; semiconductor failure mechanism analysis; switching frequency reduction method; switching loss reduction; thermal balancing; three-level neutral-point-clamped inverter topology; wind energy; Insulated gate bipolar transistors; Inverters; Junctions; Semiconductor diodes; Switches; Switching loss;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Machines and Systems (ICEMS), 2014 17th International Conference on
Conference_Location
Hangzhou
Type
conf
DOI
10.1109/ICEMS.2014.7013627
Filename
7013627
Link To Document