Finite Element Method based stress analysis and warpage prediction of SIM card packaging

SIM cards have been more and more widely used and the failure of packaging becomes a remarkable issue. In this paper, effects of die thickness and layout, material properties and packaging process parameters on the stress of dies were analyzed based on finite element simulation. The whole simulation includes two main packaging processes: cooling after die attach and molding process. The warpage of SIM card after packaging was also researched. The results reveal that the die stress is sensitive to the die thickness and material property can also affect the stress level and warpage. To lower the die stress and package warpage, manufacturers should pay enough attention to material selection and process parameter set.