DocumentCode :
22988
Title :
Low-Frequency Noise Analysis of Electrostatic Discharge Tolerance of InGaN Light-Emitting Diodes
Author :
Tzung-Te Chen ; Han-Kuei Fu ; Chun-Fan Dai ; Chien-Ping Wang ; Chun-Wen Chu ; Pei-Ting Chou
Author_Institution :
Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Volume :
60
Issue :
11
fYear :
2013
fDate :
Nov. 2013
Firstpage :
3794
Lastpage :
3798
Abstract :
In recent years, with an extensive use of InGaN light-emitting diode (LED), how to assess the LED quality and further improve the LED reliability are very important. In this paper, the noise spectrum measurement techniques are used to assess the electrostatic discharge tolerance and quality of InGaN LED devices. Experimental results show that the noise spectrum measurement distinguishing the LED device reliability is more effective than the current-voltage curve measurement. In the evidence, emission microscope, scanning electron microscope, and transmission electron microscopy images show that the noise source and the cause of failure of the LED device are attributed by the poor quality of the SiO2 and Indium Tin Oxide (ITO) interface.
Keywords :
III-V semiconductors; electrostatic discharge; failure analysis; gallium compounds; indium compounds; light emitting diodes; reliability; scanning electron microscopy; semiconductor device noise; transmission electron microscopy; wide band gap semiconductors; InGaN; InGaN light-emitting diodes; LED quality; LED reliability; SiO2-ITO; electrostatic discharge tolerance; emission microscopy; failure; low-frequency noise analysis; noise source; noise spectrum measurement techniques; scanning electron microscopy; transmission electron microscopy; Current measurement; Electrostatic discharges; Light emitting diodes; Low-frequency noise; Noise measurement; Electrostatic discharge (ESD); InGaN; light-emitting diode (LED); low frequency noise;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2281604
Filename :
6607146
Link To Document :
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