DocumentCode
2299192
Title
A high magnetic coupling, low loss, stacked balun in digital 65nm CMOS
Author
Akhtar, Siraj ; Taylor, Richard ; Litmanen, Petteri
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
2009
fDate
7-9 June 2009
Firstpage
513
Lastpage
516
Abstract
We present a high magnetic coupling, low loss, stacked balun using a thick aluminum bonding metal layer over a thick copper layer. The thick copper is used to realize a differential primary input winding that resides directly underneath a single ended spiral winding using the aluminum. The spiral forms the single ended secondary output of the balun and is rotated by 90deg so as to prevent any metal shorting for its cross under. Occupying an area of 0.078 mm2 on a digital 65 nm process, a 5 turn primary with a 3 turn secondary has a measured coupling of 0.94 and a total balun loss of 1.55 dB at 1845 MHz.
Keywords
CMOS digital integrated circuits; MMIC; baluns; windings; balun loss; differential primary input winding; digital CMOS; frequency 1845 MHz; integrated cellular band balun; loss 1.55 dB; magnetic coupling; single ended spiral winding; size 65 nm; stacked balun; thick aluminum bonding metal layer; thick copper layer; Aluminum; Bonding; Copper; Coupling circuits; Impedance matching; Instruments; Magnetic losses; Radio frequency; Receiving antennas; Spirals; 65nm; Balun; low loss; receiver; stacked; transmitter;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits Symposium, 2009. RFIC 2009. IEEE
Conference_Location
Boston, MA
ISSN
1529-2517
Print_ISBN
978-1-4244-3377-3
Electronic_ISBN
1529-2517
Type
conf
DOI
10.1109/RFIC.2009.5135592
Filename
5135592
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