• DocumentCode
    2299192
  • Title

    A high magnetic coupling, low loss, stacked balun in digital 65nm CMOS

  • Author

    Akhtar, Siraj ; Taylor, Richard ; Litmanen, Petteri

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2009
  • fDate
    7-9 June 2009
  • Firstpage
    513
  • Lastpage
    516
  • Abstract
    We present a high magnetic coupling, low loss, stacked balun using a thick aluminum bonding metal layer over a thick copper layer. The thick copper is used to realize a differential primary input winding that resides directly underneath a single ended spiral winding using the aluminum. The spiral forms the single ended secondary output of the balun and is rotated by 90deg so as to prevent any metal shorting for its cross under. Occupying an area of 0.078 mm2 on a digital 65 nm process, a 5 turn primary with a 3 turn secondary has a measured coupling of 0.94 and a total balun loss of 1.55 dB at 1845 MHz.
  • Keywords
    CMOS digital integrated circuits; MMIC; baluns; windings; balun loss; differential primary input winding; digital CMOS; frequency 1845 MHz; integrated cellular band balun; loss 1.55 dB; magnetic coupling; single ended spiral winding; size 65 nm; stacked balun; thick aluminum bonding metal layer; thick copper layer; Aluminum; Bonding; Copper; Coupling circuits; Impedance matching; Instruments; Magnetic losses; Radio frequency; Receiving antennas; Spirals; 65nm; Balun; low loss; receiver; stacked; transmitter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium, 2009. RFIC 2009. IEEE
  • Conference_Location
    Boston, MA
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4244-3377-3
  • Electronic_ISBN
    1529-2517
  • Type

    conf

  • DOI
    10.1109/RFIC.2009.5135592
  • Filename
    5135592