Title :
Stress analysis in copper plated red VCSELs
Author :
Safaisini, Rashid ; Johnson, Klein ; Hibbs-Brenner, Mary ; Lear, Kevin L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
Abstract :
Electroplated copper films used for thermal management introduce strain to red VCSEL mesas, changing laser DC characteristics. Larger plated area generally causes larger strains as determined by gain offset measurements and can double threshold current.
Keywords :
copper; electroplated coatings; semiconductor lasers; stress analysis; surface emitting lasers; thermal management (packaging); Cu; copper plated red VCSEL; electroplated copper films; gain offset measurements; stress analysis; thermal management; threshold current;
Conference_Titel :
IEEE Photonics Society, 2010 23rd Annual Meeting of the
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-5368-9
DOI :
10.1109/PHOTONICS.2010.5698851
