A novel curved CMOS image sensor integrated with imaging system

Author

Itonaga, K. ; Arimura, T. ; Matsumoto, Kaname ; Kondo, G. ; Terahata, K. ; Makimoto, S. ; Baba, M. ; Honda, Yuma ; Bori, S. ; Kai, Takafumi ; Kasahara, K. ; Nagano, M. ; Kimura, Mizue ; Kinoshita, Yuta ; Kishida, E. ; Baba, Toshihiko ; Baba, S. ; Nomura,

Author_Institution

Sony R&D Platform, Atsugi, Japan

fYear

2014

fDate

9-12 June 2014

Firstpage

1

Lastpage

2

Abstract

We realized an ultimately advanced imaging system that comprises a hemi-spherically curved, back-illuminated CMOS image sensor (BIS) and integrated lens which doubles the sensitivity at the edge of the image circle and increases the sensitivity at the center of the image circle by a factor of 1.4 with one-fifth lower dark current (J_d) than that of a planar BIS. Because the lens field curvature aberration (A_fc) was overcome in principle by the curved sensor itself, the curved BIS enables higher system sensitivity through design of a brighter lens with a smaller F number (F_n) than is possible with a planar BIS. At the same time, we controlled the tensile stress of the BIS chip to produce a curved shape that widens the energy band-gap (E_g) to obtain a lower J_d.

Keywords

CMOS image sensors; aberrations; imaging; integrated circuit manufacture; lenses; BIS chip; back-illuminated CMOS image sensor; curved CMOS image sensor; dark current; energy band-gap; image circle; imaging system; integrated lens; lens field curvature aberration; planar BIS; system sensitivity; tensile stress; Dark current; Imaging; Lenses; Sensitivity; Shape; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on

Conference_Location

Honolulu, HI

ISSN

0743-1562

Print_ISBN

978-1-4799-3331-0

Type

conf

DOI

10.1109/VLSIT.2014.6894341

Filename

6894341