DocumentCode :
230321
Title :
A novel curved CMOS image sensor integrated with imaging system
Author :
Itonaga, K. ; Arimura, T. ; Matsumoto, Kaname ; Kondo, G. ; Terahata, K. ; Makimoto, S. ; Baba, M. ; Honda, Yuma ; Bori, S. ; Kai, Takafumi ; Kasahara, K. ; Nagano, M. ; Kimura, Mizue ; Kinoshita, Yuta ; Kishida, E. ; Baba, Toshihiko ; Baba, S. ; Nomura,
Author_Institution :
Sony R&D Platform, Atsugi, Japan
fYear :
2014
fDate :
9-12 June 2014
Firstpage :
1
Lastpage :
2
Abstract :
We realized an ultimately advanced imaging system that comprises a hemi-spherically curved, back-illuminated CMOS image sensor (BIS) and integrated lens which doubles the sensitivity at the edge of the image circle and increases the sensitivity at the center of the image circle by a factor of 1.4 with one-fifth lower dark current (Jd) than that of a planar BIS. Because the lens field curvature aberration (Afc) was overcome in principle by the curved sensor itself, the curved BIS enables higher system sensitivity through design of a brighter lens with a smaller F number (Fn) than is possible with a planar BIS. At the same time, we controlled the tensile stress of the BIS chip to produce a curved shape that widens the energy band-gap (Eg) to obtain a lower Jd.
Keywords :
CMOS image sensors; aberrations; imaging; integrated circuit manufacture; lenses; BIS chip; back-illuminated CMOS image sensor; curved CMOS image sensor; dark current; energy band-gap; image circle; imaging system; integrated lens; lens field curvature aberration; planar BIS; system sensitivity; tensile stress; Dark current; Imaging; Lenses; Sensitivity; Shape; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4799-3331-0
Type :
conf
DOI :
10.1109/VLSIT.2014.6894341
Filename :
6894341
Link To Document :
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