DocumentCode :
2303633
Title :
Proceedings of 1995 IEEE International Reliability Physics Symposium
fYear :
1995
fDate :
4-6 April 1995
Keywords :
dielectric thin films; electrostatic discharge; failure analysis; hot carriers; integrated circuit packaging; integrated circuit reliability; metallisation; multichip modules; optoelectronic devices; reliability theory; semiconductor device reliability; ESD; MCM; building-in reliability; compound semiconductors; dielectrics; failure analysis; hot carriers; metallization; optoelectronics; packaging; semiconductor devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2031-X
Type :
conf
DOI :
10.1109/RELPHY.1995.513644
Filename :
513644
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2303633
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