Title :
ON-state programming and OFF-state reliability of metal-to-metal antifuse based 10 nm-thick SiNx film for 3.3 V operation
Author :
Tamura, Yoshimitsu ; Shinrik, Hiroshi
Author_Institution :
LSI Res. Lab., Kawasaki Steel Corp., Chiba, Japan
Abstract :
Reliability of newly a developed metal-to-metal antifuse (Al-0.5%Cu/10nm-thick SiNx/amorphous-like WSix) with very low ON-resistance below 10 ohm has been investigated. Sufficient OFF-state reliability can be obtained by using amorphous-like WSix film as a lower electrode, which has a remarkably smooth surface without sharp protrusions. By using Al-Cu film as an upper electrode, low ON-resistance can be easily obtained with a wide range of programming current down to 0.1 mA, which is enough to melt the lower portion of Al-Cu film and to diffuse aluminum into the SiNx film due to joule heating generated at filament. Moreover, favorable electromigration (EM) performance and ON-state stability of the antifuse programmed in plus polarity could be obtained. The result could be attributed to the final state of the filament composed of Al-W-Si, which is formed by a reaction between electromigrated tungsten through ruptured SiNx film and locally melted aluminum just on the ruptured SiNx film due to joule heating.
Keywords :
PLD programming; aluminium alloys; copper alloys; electromigration; field programmable gate arrays; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; silicon compounds; tungsten compounds; 0.1 mA; 10 nm; 10 ohm; 3.3 V; AlCu-SiN-WSi; FPGAs; OFF-state reliability; ON-state programming; electromigration performance; joule heating; locally melted material; metal-to-metal antifuse; programming current; Aluminum; Atomic force microscopy; Dielectric films; Dielectrics and electrical insulation; EPROM; Electrodes; Field programmable gate arrays; Heating; Integrated circuit interconnections; Stability;
Conference_Titel :
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2031-X
DOI :
10.1109/RELPHY.1995.513650
