Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling

Author

Thadesar, Paragkumar A. ; Li Zheng ; Bakir, Muhannad S.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2014

fDate

9-12 June 2014

Firstpage

1

Lastpage

2

Abstract

Novel technology enablers for high-performance three-dimensional (3D) system integration are demonstrated in this paper: (a) A thick silicon interposer with 65 μm diameter and 370 μm tall low-loss polymer-embedded vias on a 150 μm pitch is fabricated and characterized demonstrating a 78% reduction in insertion loss compared to similar-sized conventional TSVs at 50 GHz; (b) Two dice with embedded microfluidic heatsinks and electrical and fluidic microbumps are assembled to an interposer demonstrating lower thermal resistance, chip-to-interposer average electrical microbump resistance of 12.06 mΩ and a robust fluidic microbump interconnection.

Keywords

cooling; heat sinks; integrated circuit packaging; microfluidics; silicon; thermal resistance; three-dimensional integrated circuits; vias; 3D system integration; Si; TSVs; electrical microbump resistance; electrical microbumps; embedded microfluidic heatsinks; fluidic microbump interconnection; fluidic microbumps; frequency 50 GHz; low-loss polymer-embedded vias; low-loss silicon interposer; microfluidic cooling; resistance 12.06 mohm; size 150 mum; size 370 mum; size 65 mum; thermal resistance; thick silicon interposer; three-dimensional system integration; Fluidic microsystems; Heat sinks; Microfluidics; Polymers; Resistance; Silicon; Three-dimensional displays; 3D IC and cooling; TSV; silicon interposer;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on

Conference_Location

Honolulu, HI

ISSN

0743-1562

Print_ISBN

978-1-4799-3331-0

Type

conf

DOI

10.1109/VLSIT.2014.6894399

Filename

6894399