Title :
Thematic network adhesives in electronics-smart card roadmap
Author :
Aschenbrenner, R. ; Miessner, R.
Author_Institution :
FhG-IZM, Germany
Abstract :
Discusses interconnection technologies for standard IC and additional components: used adhesives for mechanical and electrical interconnection. The aim of this roadmap survey is to find the important technology issues. It is planned to define future material needs upon the results of the roadmap
Keywords :
adhesives; integrated circuit interconnections; integrated circuit packaging; smart cards; electrical interconnection; electronics; interconnection technologies; mechanical interconnection; roadmap survey; smart card roadmap; thematic network adhesives; Banking; Consumer electronics; Counting circuits; Electronics packaging; Instruments; Intelligent networks; Manufacturing; Medical services; Smart cards; Surface-mount technology;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860628
