• DocumentCode
    230505
  • Title

    Germanium-Tin on Silicon avalanche photodiode for short-wave infrared imaging

  • Author

    Yuan Dong ; Wei Wang ; Xin Xu ; Xiao Gong ; Dian Lei ; Qian Zhou ; Zhe Xu ; Soon-Fatt Yoon ; Gengchiau Liang ; Yee-Chia Yeo

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore (NUS), Singapore, Singapore
  • fYear
    2014
  • fDate
    9-12 June 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The first demonstration of Germanium-Tin on Silicon (Ge1-xSnx/Si) avalanche photodiode (APD) for short-wave infrared (SWIR) imaging is reported. The temperature dependence of breakdown voltage was characterized. An extracted thermal coefficient of 0.05% K-1 indicates that the Ge1-xSnx/Si APD achieved a lower thermal sensitivity than conventional III-V-based APDs. At the wavelength λ of 1600 to 1630 nm, a responsivity of ~ 1 A/W (bias voltage Vbias = -9.7 V) was achieved due to the internal avalanche gain of Ge1-xSnx/Si/Si APD. The monolithic and CMOS-compatible Ge1-xSnx/Si APD presented here shows promise in SWIR imaging applications where low-cost and high sensitivity sensing arrays are needed.
  • Keywords
    avalanche breakdown; avalanche photodiodes; germanium; infrared imaging; sensitivity analysis; silicon; tin; APD; CMOS-compatible APD; Ge1-xSnx-Si; SWIR imaging; breakdown voltage; germanium-tin on silicon avalanche photodiode; high sensitivity sensing array; internal avalanche gain; monolithic APD; short-wave infrared imaging; thermal coefficient; thermal sensitivity; wavelength 1600 nm to 1630 nm; Absorption; Imaging; PIN photodiodes; Silicon; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4799-3331-0
  • Type

    conf

  • DOI
    10.1109/VLSIT.2014.6894428
  • Filename
    6894428