Three dimensional integration and on-wafer packaging of signal centric sensors for ultra wideband systems

Future military and commercial communication systems and sensors will require a new generation of circuits with cognitive, deployable, agile, versatile, survivable and sustainable capabilities. The requirement to accommodate arbitrary-bandwidth signals, poses significant challenges to traditional time-invariant matching networks because of the gain-bandwidth restrictions and their inability to ensure a linear phase response for broadband pulse-based inputs (Bode, 1945). To address this need we propose in this paper a time-variant matching network particularly suited for pulse-based systems that is capable of accommodating high-Q RC loads.