DocumentCode
2307112
Title
Miniature multi-contact ZIF connector design using leverage from internal flexible fine metal pins
Author
Ichimura, Yoshiaki ; Endo, Hiroshi
Author_Institution
Japan Aviation Electron. Ind. Ltd., Tokyo, Japan
fYear
1993
fDate
1-4 Jun 1993
Firstpage
452
Lastpage
460
Abstract
A high density ZIF connector for LSI packages with a new structure of lead and wire-to-board connection has been developed. The outline of the prototype connector for the LSI package is as follows: 1.) contact spacing - 0.5 mm grid; 400 contacts (9.5×9.5 mm). 2.) Connectors size: 11 mm high; 18 mm×26 mm (mounting area). The principle of this mechanism, as well as two applications examples are herein introduced. In addition, the results of various test procedures performed on contacts and pins are included
Keywords
electric connectors; large scale integration; packaging; printed circuit accessories; 0.5 mm; 11 mm; LSI packages; high density ZIF connector; internal flexible fine metal pins; miniature connector design; multicontact ZIF connector; test procedures; zero force insertion; Connectors; Contacts; Electronics packaging; Large scale integration; Performance evaluation; Pins; Prototypes; Shape; Sockets; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location
Orlando, FL
Print_ISBN
0-7803-0794-1
Type
conf
DOI
10.1109/ECTC.1993.346807
Filename
346807
Link To Document