Development of a 36 GHz millimeter-wave BGA package

Author

Hongwei Liang ; Laskar, J. ; Hyslop, M. ; Panicker, R.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

fYear

2000

fDate

11-16 June 2000

Firstpage

65

Abstract

We present a 36 GHz ball grid array (BGA) package design and its experimental characterization. A novel wideband de-embedding technique has been developed for accurate characterization of the package. A hybrid model has been developed for the transition including the ball and via interconnection and is verified with the measurement data of a microstrip line test structure. The transition demonstrates an insertion loss better than 0.3 dB to 36 GHz. The performance is demonstrated by measuring an MMIC amplifier built on the package. Our results show that the BGA is a cost-effective solution for millimeter wave RFIC packaging.

Keywords

MIMIC; MMIC amplifiers; ball grid arrays; integrated circuit interconnections; integrated circuit packaging; losses; microstrip lines; 36 GHz; MMIC amplifier; RFIC packaging; ball grid array; hybrid model; insertion loss; measurement data; microstrip line test structure; millimeter-wave BGA package; via interconnection; wideband de-embedding technique; Calibration; Coplanar waveguides; Electronics packaging; Integrated circuit interconnections; Microstrip; Millimeter wave communication; Millimeter wave measurements; Millimeter wave technology; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.860886

Filename

860886