DocumentCode :
2311294
Title :
Bumping technology and chip & package interaction
Author :
Tsukada, Yoshinori
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
43
Keywords :
flip-chip devices; packaging; bumping technology; chip-package interaction; flip chip packaging; Arrays; Attenuation; Flip chip; Inductance; Joints; Packaging; Switching circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699495
Filename :
5699495
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2311294
بازگشت