Title :
Low cost hot embossing process for plastics microfluidic chips fabrication
Author :
Lomas, T. ; Mongpraneet, S. ; Wisitsoraat, A. ; Jaruwongrungsee, K. ; Sappat, A. ; Maturos, T. ; Chevasuvit, F. ; Tuantranont, Adisorn
Author_Institution :
Nanoelectron. & MEMS Lab., Nat. Electron. & Comput. Technol. Center, Pathumthani, Thailand
Abstract :
In this work, we develop plastic microfluidic chips based on low cost hot embossing process with metal micromold. Metal micromold was formed on aluminum substrates by CNC milling machine and high precision micromachine. The hot embossing system is in-house made with computer aid design by Solid Work program. The system consists of four main parts, structural body, heating system, compressive system and control electronics. The compressive system consists of two top hydraulic single-stage pistons and four middle-stage pistons. Polymethyl methacrylate (PMMA) microfluidic chips were then produced by hot embossing under different applied temperatures and time. It was found that optimum temperature and time for minimum contraction and depth error were 80 degree C and 2-5 minutes. The developed technique offer advantages for microfluidic chip fabrication in term of quality, complexity and cost.
Keywords :
CAD; bioMEMS; biomedical engineering; computerised numerical control; embossing; hot working; microfluidics; micromachining; milling; moulding; production engineering computing; CNC milling machine; biomedical engineering; compressive system; computer aid design; heating system; high precision micromachine; hot embossing process; metal micromold; plastics microfluidic chips fabrication; Aluminum; Chip scale packaging; Computer numerical control; Costs; Embossing; Metalworking machines; Microfluidics; Pistons; Plastics; Temperature;
Conference_Titel :
Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, 2009. ECTI-CON 2009. 6th International Conference on
Conference_Location :
Pattaya, Chonburi
Print_ISBN :
978-1-4244-3387-2
Electronic_ISBN :
978-1-4244-3388-9
DOI :
10.1109/ECTICON.2009.5137048