DocumentCode :
2312217
Title :
Compression mold development for multiple propose applications
Author :
Tin-Huei Dong
Author_Institution :
Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
23
Keywords :
compression moulding; compression mold development; multiple propose applications; Compounds; Films; Laminates; Plasma temperature; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699550
Filename :
5699550
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2312217
بازگشت