DocumentCode :
2312237
Title :
Wafer backside coating development for die attach process
Author :
Pan, Kegang
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
20
Keywords :
adhesive bonding; coatings; electronics packaging; microassembling; printed circuit manufacture; BLT uniformity; PCB substrate; Si dice bonding; adhesive; die attach process; wafer backside coating development; Coatings; Electronic mail; Electronics industry; Materials; Microassembly; Process control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699551
Filename :
5699551
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2312237
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