• DocumentCode
    2317829
  • Title

    New semiconductive compound technology for solid dielectric insulated power cables

  • Author

    Han, S. Joon ; Gross, Laurence H. ; Lastovica, John, III

  • Author_Institution
    Dow Chem. Co., Somerset, NJ, USA
  • fYear
    2004
  • fDate
    19-22 Sept. 2004
  • Firstpage
    354
  • Lastpage
    357
  • Abstract
    New formulation technologies have been developed for application in semiconductive conductor shield compounds. These technologies offer several advantages for conductor shields relative to the traditional polyethylene copolymers of alkyl-acrylate, or vinyl-acetate, that have been in commercial use for over 30 years. New semiconductive conductor shield compounds have been tested extensively both in the laboratory and on insulated power cables. A conventional shield class of product was produced with the new technology utilizing a furnace black. It was used to manufacture a commercial scale 15 kV cable with XLPE insulation. This cable was then tested in long term wet aging under 4,4´ ACLT conditions and found to exhibit excellent performance. The cable extrusion study showed excellent processability in comparison to conventional shields.
  • Keywords
    XLPE insulation; ageing; conductors (electric); dielectric materials; furnaces; power cable insulation; power cable testing; 15 kV; XLPE insulation; alkyl-acrylate; cable extrusion study; conductor shields; cross linked polyethylene insulation; furnace black; polyethylene copolymers; semiconductive conductor shield compounds; solid dielectric insulated power cables; vinyl-acetate; wet aging; Cable insulation; Cable shielding; Conductors; Dielectrics and electrical insulation; Furnaces; Laboratories; Polyethylene; Power cables; Semiconductor device testing; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-8447-4
  • Type

    conf

  • DOI
    10.1109/ELINSL.2004.1380589
  • Filename
    1380589