• DocumentCode
    2318316
  • Title

    Wide Range Temperature Sensors for Harsh Environments

  • Author

    Elbuluk, M.E. ; Hammoud, A. ; Patterson, R.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Akron, Akron, OH, USA
  • fYear
    2009
  • fDate
    4-8 Oct. 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Silicon-on-insulator (SOI) parts are designed for high temperature applications and the potential exists about their performance at cryogenic temperature conditions. In this paper, the performance of SOI devices and circuits were evaluated under extreme temperatures and thermal cycling. Two oscillator circuits were constructed using a new SOI 555 timer chip and used as temperature sensors in harsh environments encompassing jet engines and space mission applications. The circuits, were evaluated between -190degC and +200degC. The output of each circuit produced a stream of square pulses whose frequency was a function of the sensed temperature. The results indicate that both circuits performed relatively well over the entire test temperature range. In addition, the performance of either circuit did not undergo any change after subjecting the circuits to limited thermal cycling over the temperature regime of -190degC and +200degC, and the circuits were able to cold start at -195degC.
  • Keywords
    cryogenic electronics; high-temperature electronics; jet engines; oscillators; silicon-on-insulator; space vehicle electronics; temperature sensors; SOI 555 timer chip; Si-SiO2; cryogenic temperature; extreme temperature electronics; high temperature applications; jet engines; oscillator circuit; silicon-on-insulator; space mission; temperature -190 C to 200 C; thermal cycling; wide range temperature sensor; Circuit testing; Cryogenics; Frequency; Jet engines; Oscillators; Performance evaluation; Pulse circuits; Silicon on insulator technology; Space missions; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 2009. IAS 2009. IEEE
  • Conference_Location
    Houston, TX
  • ISSN
    0197-2618
  • Print_ISBN
    978-1-4244-3475-6
  • Type

    conf

  • DOI
    10.1109/IAS.2009.5324840
  • Filename
    5324840