Title :
Motion of free conducting particles in a single phase compressed gas insulated bus duct with electromagnetic field effect
Author :
Kumar, G. V Nagesh ; Amarnath, J. ; Singh, B.P.
Author_Institution :
Vignan´´s Inst. of Inf. Technol., Visakhapatnam
Abstract :
Metallic particle contamination is one of the areas of insulation design that are considered critical. The management and control of particle contamination are crucial considerations as the industry moves forward to higher voltage GIS and long GITL designs using SF6 in some components. Free conducting particles may lower the corona onset and breakdown voltage of a GIS/GITL system considerably. Under an applied electric field a conducting particle acquires a charge and lifts off from its resting position on the conductor when the electromagnetic force from the field becomes equal to the gravity force. Metallic particles move randomly in a horizontally mounted GIS/GITL system due to the electrode surface roughness and particle irregularities. Under 50 Hz AC voltage, the particle can cross the gap at a sufficiently high voltage level. Monte Carlo simulation is carried out on a single phase GIS for determining the motion of free conducting particles in the presence of electromagnetic field. The results have been presented and analyzed.
Keywords :
Monte Carlo methods; SF6 insulation; corona; electric breakdown; electromagnetic fields; gas insulated substations; GIS-GITL system; Monte Carlo simulation; SF6 insulation; breakdown voltage; corona; electromagnetic field effect; electromagnetic force; free conducting particles; metallic particle contamination; single phase compressed gas insulated bus duct; Contamination; Corona; Ducts; Electrical equipment industry; Electromagnetic fields; Gas insulated transmission lines; Gas insulation; Geographic Information Systems; Industrial control; Voltage control; Electromagnetic Field; Gas Insulated Substations; Metallic Particles;
Conference_Titel :
Condition Monitoring and Diagnosis, 2008. CMD 2008. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-1621-9
Electronic_ISBN :
978-1-4244-1622-6
DOI :
10.1109/CMD.2008.4580317