Title :
Package of VME pressure sensors
Author :
Xia, Shanhong ; Tao, Xinxin ; Jia, Shuisheng
Author_Institution :
Inst. of Electron., Acad. Sinica, Beijing, China
Abstract :
Package is one of the most important steps in fabricating vacuum microelectronic (VME) pressure sensors. This issue has received increasing interest in recent years. In this paper, we presents our new efforts in packaging VME pressure sensors.
Keywords :
microsensors; packaging; pressure sensors; vacuum microelectronics; VME pressure sensor; packaging; vacuum microelectronic device; Anodes; Biomembranes; Bonding processes; Cathodes; Electronics packaging; Insulation; Sensor arrays; Temperature sensors; Voltage; Wafer bonding;
Conference_Titel :
Vacuum Microelectronics Conference, 1998. Eleventh International
Conference_Location :
Asheville, NC, USA
Print_ISBN :
0-7803-5096-0
DOI :
10.1109/IVMC.1998.728689
