DocumentCode :
2321571
Title :
Preparation and characterization of segmented-type thermoelectric branches of Bi2Te3/PbTe
Author :
Noda, Yasutoshi ; Kang, Yan-Sheng ; Niino, Masayuki
Author_Institution :
Dept. of Mater. Sci., Tohoku Univ., Sendai, Japan
fYear :
1997
fDate :
26-29 Aug 1997
Firstpage :
371
Lastpage :
374
Abstract :
Thermoelectric materials, metal/semiconductor joints and segmented-type thermocouple branches were prepared by plasma-activated sintering (PAS) using powdered source materials of Bi2Te3, PbTe and metals (Cu, Fe and Ni). The sintering was carried out in vacuum under a axial pressure of 45 MPa by pulse current heating followed by DC current heating, where temperature was differently controlled for sintering of Bi2Te3 and PbTe. The sintered materials were characterized by measuring the thermoelectric properties. The electron probe microanalyses indicated that no serious diffusion occurred at the joint interfaces of Fe/PbTe and Bi2T3/PbTe where an abrupt change of the potential voltage was observed in their p-type joints. Therefore SnTe and Ni layers were inserted in the Fe/p-PbTe and Bi2Te3 /PbTe joints, respectively, to keep low resistance. The thermoelectric branches were Ni/Bi2(Te,Se)3Ni/PbTe/Ni for n-type and Ni/(Bi,Sb) 2Te3/Ni/SnTe/PbTe/SnTe/Ni for p-type
Keywords :
IV-VI semiconductors; bismuth compounds; lead compounds; semiconductor heterojunctions; sintering; thermoelectric power; Bi2Te3-PbTe; Bi2Te3/PbTe; DC current heating; electron probe microanalyses; plasma-activated sintering; pulse current heating; segmented-type thermoelectric branches; thermoelectric properties; Bismuth; Heating; Inorganic materials; Iron; Joining materials; Plasma materials processing; Plasma sources; Semiconductor materials; Tellurium; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location :
Dresden
ISSN :
1094-2734
Print_ISBN :
0-7803-4057-4
Type :
conf
DOI :
10.1109/ICT.1997.667155
Filename :
667155
Link To Document :
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