Title :
Performance Testing of Mobile Applications at the Unit Test Level
Author :
Kim, Heejin ; Choi, Byoungju ; Wong, Eric W.
Author_Institution :
Dept. of Comput. Sci. & Eng., Ewha Womans Univ., Seoul, South Korea
Abstract :
With the rapid growth of the wireless market and the development of various mobile devices, innovative methods and technologies to produce high-quality mobile applications and reduce time to market have been emerging. Mobile applications are often characterized by an array of limitations such as the short development lifecycle to gain a competitive advantage and difficulties to update once released. Hence, rigorous testing on the applications is required before distribution to the market, including structural white-box, functional black-box, integration and system testing. Although recently performance testing at the system test level has become crucial given its direct connection with the product quality improvement, most such tests are confined to the areas of load, usability, and stress testing. Moreover, the implementation itself is insufficient due to the limitations of the development environment. This paper proposes a method to support performance testing utilizing a database established through benchmark testing in emulator-based test environment at the unit test level. It also presents the tool that supports the proposed method of performance testing and verifies the reliability of performance test results through experiments.
Keywords :
integrated software; program testing; emulator-based test environment; functional black-box; integration; mobile applications; performance testing; structural white-box; system testing; unit test level; wireless market; Application software; Benchmark testing; Computer science; Databases; Mobile computing; Process control; Software performance; Software testing; Stress; System testing; emulator-based test; mobile application; performance test; unit test;
Conference_Titel :
Secure Software Integration and Reliability Improvement, 2009. SSIRI 2009. Third IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-0-7695-3758-0
DOI :
10.1109/SSIRI.2009.28