Higher order modeling of surface-wire junctions

Electromagnetic analysis of surface-wire structures has numerous applications in the area of electromagnetic compatibility (EMC), circuit simulation and antenna design. The lack of a higher order technique to analyze wire scatterers as well as the lack of suitable surface-wire bases prevented higher order analysis of structures containing surface-wire junctions. Recent research has demonstrated a new technique to perform higher order analysis of wire scatterers. This work will present interpolatory higher order bases for surface-wire junctions and perform Method of Moments (MoM) analysis of structures containing surface-wire junctions. Numerical results show that accelerated convergence is achieved with these higher-order bases. The frequency domain approach can then be extended to perform higher order transient modeling surface-wire junctions using a suitable Time Domain Integral Equations (TDIE) based approach.