DocumentCode
2328678
Title
A low-cost, compact-size 10-Gigabit Ethernet optical sub-assembly using a novel opto-electronic hybrid integration platform
Author
Miyoshi, K. ; Sugimoto, Taku ; Kurata, K. ; Kami, N. ; Tanaka, K. ; Yamamoto, K. ; Kurihara, M. ; Watanabe, T.
Author_Institution
Networking Res. Labs., NEC Corp., Tsukuba, Japan
fYear
2003
fDate
23-28 March 2003
Firstpage
470
Abstract
A novel opto-electronic hybrid integration platform using a flexible resin interposer on a silicon substrate has achieved low-cost, compact-size optical sub-assemblies. A 10 km error-free-transmission has been demonstrated with the optical sub-assemblies for 10-Gigabit Ethernet transceivers.
Keywords
elemental semiconductors; integrated optoelectronics; optical fibre LAN; resins; silicon; substrates; transceivers; 10 Gbits/s; 10 km; Ethernet transceivers; error-free-transmission; flexible resin interposer; optical sub-assembly; opto-electronic hybrid integration platform; silicon substrate; Ethernet networks; High speed optical techniques; Integrated optics; Laboratories; National electric code; Optical devices; Packaging; Resins; Silicon; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communications Conference, 2003. OFC 2003
Print_ISBN
1-55752-746-6
Type
conf
DOI
10.1109/OFC.2003.1248346
Filename
1248346
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