DocumentCode :
2329269
Title :
Future Manufacturing Technology For LC Flat Panel Display Devices
Author :
Katayama, M.
Author_Institution :
Sharp Corporation
fYear :
1994
fDate :
21-22 June 1994
Firstpage :
81
Lastpage :
84
Abstract :
The glass substrate size will be expanded to decrease the dispaly cost because the panel cost is decided mostly by how many panels can be formed in a sub- stratethe. It causes some problems in the equipments and processes. For example, it needs deposition methods with high and uniform deposition rate and without particle, the accurate stepping alignment, uniform etching characteristics and so on. So it is important to develop the appropriate process on the Iarge-sized substrates. The self-alignment technique and dry etching process will be discussed in this paper.
Keywords :
Costs; Dry etching; Flat panel displays; Glass manufacturing; Internal stresses; Large scale integration; Manufacturing processes; Pulp and paper industry; Substrates; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location :
Tokyo, Japan
Type :
conf
DOI :
10.1109/ISSM.1994.729428
Filename :
729428
Link To Document :
بازگشت