Equipment Analysis And Wafer Parameter Prediction Using Real-Time Tool Data

We propose a system which uses real-time equipment sensor signals to automatically detect and analyze semiconductor equipment faults, and evaluate the impact of the fault on the wafer parameters. The system, which has been applied on plasma processes, consists of three modules: (1) fault detection, (2) fault analysis, and (3) prediction of final wafer parameters such as etch rate, uniformity, selectivity, and anisotropy.