• DocumentCode
    23316
  • Title

    Microresonant accelerometer composed of silicon substrate and quartz double-ended tuning fork with temperature isolator

  • Author

    Cun Li ; Yulong Zhao ; Rongjun Cheng ; Zhongliang Yu

  • Author_Institution
    State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
  • Volume
    9
  • Issue
    10
  • fYear
    2014
  • fDate
    10 2014
  • Firstpage
    664
  • Lastpage
    668
  • Abstract
    A microresonant accelerometer which consists of silicon substrate and a quartz double-ended tuning fork (DETF) is described. A temperature isolator structure on the silicon substrate is designed to decrease the influence of thermal stress on the DETF´s tines. Two stiff ends of the quartz DETF are mounted on the proof mass and temperature isolator, respectively. When acceleration is applied, the proof mass will move, inducing the variation of axial stress on the DETF´s tines. The resonance frequency of the DETF´s tines will change corresponding to the stress, so acceleration can be measured. The DETF is excited by the inherent piezoelectric property of quartz based on the anti-phase in-plane bending model. Both the silicon substrate and the DETF are fabricated by micromachining. The sensor is analysed by finite-element simulation. According to the simulation, the temperature isolator decreases thermal stress by 30.2%. Experimental results show that the resonance frequency of the sensor is 35.2563 kHz and the sensitivity is 8.55 Hz/g, which is in good agreement with analytical calculation.
  • Keywords
    acceleration measurement; accelerometers; bending; crystal resonators; finite element analysis; micromachining; micromechanical resonators; microsensors; temperature sensors; thermal stresses; vibrations; Si; acceleration measurement; antiphase in-plane bending model; axial stress; finite element simulation; frequency 35.2563 kHz; micromachining; microresonant accelerometer; piezoelectric property; proof mass; quartz DETF fabrication; quartz double-ended tuning fork; resonance frequency; sensor; temperature isolator structure; thermal stress;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2014.0265
  • Filename
    6942362