DocumentCode
23316
Title
Microresonant accelerometer composed of silicon substrate and quartz double-ended tuning fork with temperature isolator
Author
Cun Li ; Yulong Zhao ; Rongjun Cheng ; Zhongliang Yu
Author_Institution
State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
Volume
9
Issue
10
fYear
2014
fDate
10 2014
Firstpage
664
Lastpage
668
Abstract
A microresonant accelerometer which consists of silicon substrate and a quartz double-ended tuning fork (DETF) is described. A temperature isolator structure on the silicon substrate is designed to decrease the influence of thermal stress on the DETF´s tines. Two stiff ends of the quartz DETF are mounted on the proof mass and temperature isolator, respectively. When acceleration is applied, the proof mass will move, inducing the variation of axial stress on the DETF´s tines. The resonance frequency of the DETF´s tines will change corresponding to the stress, so acceleration can be measured. The DETF is excited by the inherent piezoelectric property of quartz based on the anti-phase in-plane bending model. Both the silicon substrate and the DETF are fabricated by micromachining. The sensor is analysed by finite-element simulation. According to the simulation, the temperature isolator decreases thermal stress by 30.2%. Experimental results show that the resonance frequency of the sensor is 35.2563 kHz and the sensitivity is 8.55 Hz/g, which is in good agreement with analytical calculation.
Keywords
acceleration measurement; accelerometers; bending; crystal resonators; finite element analysis; micromachining; micromechanical resonators; microsensors; temperature sensors; thermal stresses; vibrations; Si; acceleration measurement; antiphase in-plane bending model; axial stress; finite element simulation; frequency 35.2563 kHz; micromachining; microresonant accelerometer; piezoelectric property; proof mass; quartz DETF fabrication; quartz double-ended tuning fork; resonance frequency; sensor; temperature isolator structure; thermal stress;
fLanguage
English
Journal_Title
Micro & Nano Letters, IET
Publisher
iet
ISSN
1750-0443
Type
jour
DOI
10.1049/mnl.2014.0265
Filename
6942362
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