3D integration: Opportunities, design challenges and approaches

Summary form only given. More than Moore technologies like 3D-integration enable the dense integration of different circuits. With the right partitioning of functional units in a die stack; the system performance can be increased and the power consumption reduced. Design of 3D-integrated systems requests the consideration of several electrical and multi-physical interactions in a stack, e.g. thermal management, power distribution and electromagnetic compatibility stronger than in 2D-SoC-design. Therefore new design flows and tools are under development. The tutorial outlines the current status of technologies and applications for 3D-integration and gives an overview on the design challenges. Approaches for 3D design-flow and algorithms will be presented.