DocumentCode :
2342627
Title :
Comparative study of non-standard power diodes
Author :
Tan, Cher Ming ; Raghavan, Nagarajan ; Sun, Lina ; Hsu, Chuck ; Wang, Chase
Author_Institution :
Div. of Circuits & Syst., Nanyang Technol. Univ., Singapore
fYear :
2009
fDate :
25-27 May 2009
Firstpage :
3307
Lastpage :
3314
Abstract :
Various non-standard power diode structures have been proposed which are superior in performance in comparison to the standard power diode. However, each of these structures help optimize certain electrical parameters with corresponding trade-offs for others. In this work, the electrical parameters of three non-standard diode structures viz. SPEED diode, BUFFER diode and CLC (carrier lifetime control) diode are evaluated in comparison to those of the conventional P+NN+ standard diode. A design of experiment (DOE) combined with extensive MEDICI simulation is performed, followed by response surface methodology (RSM) to empirically relate the electrical parameters with the diode structural and doping parameters. A global optimization algorithm, known as simulated annealing (SA) is used to optimize each individual electrical parameter. Sensitivity analysis for the optimized electrical parameter is also performed to study the effects of inherent process variations on the device electrical parameters, indicating the manufacturability of the non-standard power diodes.
Keywords :
design of experiments; power semiconductor diodes; simulated annealing; BUFFER diode; MEDICI simulation; P+NN+ standard diode; SPEED diode; carrier lifetime control; design of experiment; electrical parameters; global optimization algorithm; nonstandard power diodes; response surface methodology; simulated annealing; Charge carrier lifetime; Diodes; Doping; Manufacturing processes; Medical simulation; Neural networks; Response surface methodology; Sensitivity analysis; Simulated annealing; US Department of Energy; BUFFER diode; CLC diode; MEDICI Simulation; Manufacturability; Response Surface Method; SPEED diode; Sensitivity Analysis; Simulated Annealing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications, 2009. ICIEA 2009. 4th IEEE Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-2799-4
Electronic_ISBN :
978-1-4244-2800-7
Type :
conf
DOI :
10.1109/ICIEA.2009.5138815
Filename :
5138815
Link To Document :
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