Title :
Low-stress silicon nitride for insulating multielectrode arrays
Author :
James, Kristofer J. ; Normann, Richard A.
Author_Institution :
Dept. of Bioeng., Utah Univ., Salt Lake City, UT, USA
Abstract :
Discusses the use of low-stress silicon nitride for the insulation of a silicon-based multielectrode array. Tested parameters include adhesion, resistance, and biocompatibility. Adhesion of the silicon nitride to silicon test strips and resistance measurements made during accelerated life testing show favorable results. Initial biocompatibility testing has shown that the material is non-toxic. These initial findings make low-stress silicon nitride a promising material for the insulation of multielectrode arrays
Keywords :
adhesion; biomedical equipment; encapsulation; insulating materials; microelectrodes; silicon compounds; Si3N4; accelerated life testing; biocompatibility; low-stress silicon nitride; multielectrode arrays insulation; nontoxic material; resistance measurements; silicon test strips; silicon-based multielectrode array; Adhesives; Biological materials; Dielectric materials; Electrodes; Frequency; Immune system; Insulation; Platinum; Silicon; System testing;
Conference_Titel :
Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-2050-6
DOI :
10.1109/IEMBS.1994.415170
