DocumentCode :
2345220
Title :
A high reliability, reworkable, fluorinated poly(phenylene ether ketone) (12F-PEK) coating for MOEMS and optical systems packaging
Author :
Pike, R.T. ; Adkins, C.L. ; Newton, C.M. ; Bryant, C.E.
Author_Institution :
Microsystems Technol. Group, Harris Corp., Palm Bay, FL, USA
fYear :
2002
fDate :
2002
Firstpage :
326
Lastpage :
330
Abstract :
A fluorinated poly(phenylene ether ketone) encapsulant has been identified as a high-performance chemically reworkable thermoplastic with near hermetic protection. The 12F-PEK has legacy as a high-reliability microelectronics coating for bare silicon and gallium arsenide die and microelectronics packages including PEM, CSP, PCB, COB, SCM, MCM, and MEMS. It has recently been discovered that the 12F-PEK coating is a peripheral packaging candidate for MOEMS, electro-optical, and micro-scale optical applications. Characterization of the 12F-PEK encapsulant revealed a refractive index of 1.51 from 200-900nm, <5% haze from 350-800nm, >90% transmission from 1000-2100nm, 0.07% moisture absorption, and no failures at 85°C/85% RH/5V Bias/2500 hours with Sandia ATC 2.6 TVs. The low water absorption and long-term stability of the 12F-PEK fluoropolymer presents a novel approach for packaging optical systems that will be subjected to hostile environmental conditions
Keywords :
encapsulation; light transmission; micro-optics; moisture; packaging; polymer films; refractive index; reliability; 1000 to 2100 nm; 12F-PEK coating; 200 to 900 nm; 350 to 800 nm; 5 V; 85 C; COB; CSP; GaAs; MCM; MEMS; MOEMS packaging; PCB; PEM; SCM; Si; bare die; chemical reworking; fluorinated poly(phenylene ether ketone) encapsulant; haze; hermetic protection; hostile environment; light transmission; long-term stability; microelectronics package; moisture absorption; optical system packaging; refractive index; reliability; thermoplastic fluoropolymer; Absorption; Chemicals; Coatings; Gallium arsenide; Microelectronics; Optical refraction; Optical variables control; Packaging; Protection; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
Type :
conf
DOI :
10.1109/ISAPM.2002.990406
Filename :
990406
Link To Document :
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