Interconnects and transitions in multilayer LTCC multichip modules for 24 GHz ISM-band applications

Author

Simon, W. ; Kulke, R. ; Wien, A. ; Rittweger, M. ; Wolff, I. ; Girard, A. ; Bertinet, J.-P.

Author_Institution

Inst. of Mobile and Satellite Commun. Tech., Kamp-Lintfort, Germany

Volume

2

fYear

2000

fDate

11-16 June 2000

Firstpage

1047

Abstract

Multilayer LTCC substrates with screen printed conductors are considered as a key technology for coming RF wireless communication and automotive applications. Small but expensive MMICs should be integrated in a much cheaper LTCC environment to become a multichip module (MCM). Interconnects between the environmental waveguides and the integrated chips have been designed, optimized, fabricated and evaluated by the authors, which are partners in the European R&D project RAMP.

Keywords

MMIC; ceramic packaging; integrated circuit interconnections; multichip modules; waveguide transitions; 24 GHz; ISM-band applications; MMICs; RAMP; RF wireless communication; automotive applications; environmental waveguides; multilayer LTCC multichip modules; screen printed conductors; transitions; Ceramics; Conductors; Feeds; Finite difference methods; Microstrip; Multichip modules; Nonhomogeneous media; Radio frequency; Time domain analysis; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.863536

Filename

863536