• DocumentCode
    2347841
  • Title

    An automated technique to identify defective CMOS devices based on linear regression analysis of transient signal data

  • Author

    Plusquellic, James F. ; Chiarulli, Donald M. ; Levitan, Steven P.

  • Author_Institution
    Dept. of Comput. Sci., Maryland Univ., Baltimore, MD, USA
  • fYear
    1998
  • fDate
    12-13 Nov 1998
  • Firstpage
    32
  • Lastpage
    36
  • Abstract
    Transient signal analysis is a digital device testing method that is based on the analysis of voltage transients at multiple test points and on IDD switching transients on the supply rails. We show that it is possible to identify defective devices by analyzing the transient signals measured at test points on paths not sensitized from the defect site. The small signal variations generated at these test points are analyzed in both the time and frequency domain. Linear regression analysis is used to show the absence of correlation in these signals across the outputs of bridging and open drain defective devices. A statistical method and an algorithm for identifying defective devices are presented that is based on the standard deviation of regression residuals computed over a compressed representation of these signals
  • Keywords
    CMOS digital integrated circuits; automatic testing; integrated circuit testing; statistical analysis; transient analysis; IDD switching transients; automated technique; bridging defective devices; defective CMOS devices; digital device testing method; linear regression analysis; multiple test points; open drain defective devices; statistical method; transient signal data; voltage transients; Frequency domain analysis; Linear regression; Rails; Signal analysis; Signal generators; Signal processing; Statistical analysis; Testing; Transient analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IDDQ Testing, 1998. Proceedings. 1998 IEEE International Workshop on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-8186-9191-3
  • Type

    conf

  • DOI
    10.1109/IDDQ.1998.730729
  • Filename
    730729