DocumentCode
2348422
Title
6C-2 Use of SAWs for Sub-Micron Detection of Dielectric Damage in Interconnects for Microelectronics
Author
Iacopi, F. ; Brongersma, S.H. ; Mazurenko, A. ; Antonelli, G.A.
Author_Institution
IMEC, Leuven
fYear
2006
fDate
2-6 Oct. 2006
Firstpage
269
Lastpage
272
Abstract
The application of SAWs as metrology technique for the detection of densification damage to dielectrics upon interconnects manufacturing processes is proposed. The technique is applied on wafer-level to both blanket films and patterned damascene structures. The non-contact nature of this metrology enables in-line tuning of integration processes to keep both top and sidewall damage under control as thickness and width of the dielectric features are further downscaled according to Moore´s predictions
Keywords
densification; dielectric materials; flaw detection; integrated circuit interconnections; surface acoustic waves; ultrasonic materials testing; SAW; damascene structures; densification; dielectric damage detection; interconnects; metrology; microelectronics; surface acoustic waves; Acoustic waves; Dielectric thin films; Metrology; Microelectronics; Optical films; Optical scattering; Optical surface waves; Plasma measurements; Sawing machines; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2006. IEEE
Conference_Location
Vancouver, BC
ISSN
1051-0117
Print_ISBN
1-4244-0201-8
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2006.81
Filename
4151937
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