DocumentCode :
2349280
Title :
Simulation and characterization of electronic packages
Author :
Lee, Andy ; Sen, Bidyut ; Tahmassebi, Shawn
Author_Institution :
SiliconGraphics Inc.
fYear :
1994
fDate :
1994
Keywords :
Art; Electronic packaging thermal management; Electronics packaging; Finite element methods; Plastic packaging; Power measurement; Power system modeling; Rapid thermal processing; Software packages; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
Type :
conf
DOI :
10.1109/EDMS.1994.863876
Filename :
863876
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2349280
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