• DocumentCode
    235030
  • Title

    Package embedded inductors for integrated voltage regulators

  • Author

    Lambert, William J. ; Hill, Michael J. ; Radhakrishnan, Krishnaja ; Wojewoda, Leigh ; Augustine, Anne E.

  • Author_Institution
    Assembly & Test Technol. Dev., Intel Corp., Chandler, AZ, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    528
  • Lastpage
    534
  • Abstract
    Intel® 4th generation Core™ microprocessors are powered by high frequency integrated switching voltage regulators. The inductors required to implement these regulators were constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the simulation and measurement of these embedded inductors including representative results from production packages.
  • Keywords
    flip-chip devices; microprocessor chips; voltage regulators; Intel 4th generation core microprocessors; high frequency integrated switching voltage regulators; integrated voltage regulators; organic flip chip packaging; package embedded inductors; routing layers; Electrical resistance measurement; Frequency measurement; Impedance; Inductors; Probes; Regulators; Routing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897335
  • Filename
    6897335
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235030