Title :
Sensing and MEMS devices in thin-film SOI MOS technology
Author :
Raskin, Jean-Pierre
Author_Institution :
Inst. of Inf. & Commun. Technol., Electron. & Appl. Math. (ICTEAM), Univ. Catholique de Louvain (UCL), Louvain-la-Neuve, Belgium
Abstract :
The presentation conclude that thick SOI MEMS are on the market, possibility to build high quality integrated sensors and actuators based on CMOS materials, cointegration of bulk and surface micromachined MEMS with their associated SOI CMOS electronics, internal stress in thin films is of interest to and build-up 3D MEMS and develop nanomechanical testing lab-on-chip.
Keywords :
CMOS integrated circuits; electric actuators; electric sensing devices; internal stresses; lab-on-a-chip; micromechanical devices; nanotechnology; silicon-on-insulator; thin films; 3D MEMS; CMOS material; SOI CMOS electronics; high quality integrated actuator; high quality integrated sensor; nanomechanical testing lab-on-chip; sensing device; surface micromachined MEMS device; thin film internal stress; thin-film SOI MOS technology; CMOS integrated circuits; Industries; Integrated circuit modeling; Micromechanical devices; Semiconductor device modeling; Sensors; Substrates;
Conference_Titel :
SOI Conference (SOI), 2011 IEEE International
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-61284-761-0
Electronic_ISBN :
1078-621X
DOI :
10.1109/SOI.2011.6081789
