Title :
A thermal-driven floorplanning algorithm for 3D ICs
Author :
Cong, Jason ; Wei, Jie ; Zhang, Yan
Author_Institution :
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Abstract :
As the technology progresses, interconnect delays have become bottlenecks of chip performance. 3D integrated circuits are proposed as one way to address this problem. However, thermal problem is a critical challenge for 3D IC circuit design. We propose a thermal-driven 3D floorplanning algorithm. Our contributions include: (1) a new 3D floorplan representation, CBA and new interlayer local operations to more efficiently exploit the solution space; (2) an efficient thermal-driven 3D floorplanning algorithm with an integrated compact resistive network thermal model (CBA-T); (3) two fast thermal-driven 3D floorplanning algorithms using two different thermal models with different runtime and quality (CBA-T-Fast and CBA-T-Hybrid). Our experiments show that the proposed 3D floorplan algorithm with CBA representation can reduce the wirelength by 29% compared with a recent published result from (Hsiu et al., 2004). In addition, compared to a nonthermal-driven 3D floorplanning algorithm, the thermal-driven 3D floorplanning algorithm can reduce the maximum on-chip temperature by 56%.
Keywords :
integrated circuit interconnections; integrated circuit layout; thermal management (packaging); 3D IC circuit design; 3D floorplan representation; 3D integrated circuits; CBA; chip performance; integrated compact resistive network thermal model; interconnect delays; interlayer local operations; maximum on-chip temperature reduction; thermal-driven floorplanning algorithm; wirelength reduction; Circuit synthesis; Delay; Integrated circuit interconnections; Integrated circuit packaging; Radio frequency; Rapid thermal processing; System-on-a-chip; Thermal conductivity; Thermal resistance; Three-dimensional integrated circuits;
Conference_Titel :
Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
Print_ISBN :
0-7803-8702-3
DOI :
10.1109/ICCAD.2004.1382591