Manufacturing readiness of BVA technology for ultra-high bandwidth package-on-package

Author

Katkar, Rajesh ; Co, Rey ; Zohni, Wael

Author_Institution

Invensas Corp., San Jose, CA, USA

fYear

2014

fDate

27-30 May 2014

Firstpage

1389

Lastpage

1395

Abstract

Bond Via Array (BVA) technology has been developed to enable more than 1000 vertical connections between memory and processor components in a standard outline Package-on-Package (PoP) configuration. This higher density interconnect more than doubles current PoP capability and thereby addresses next generation wide IO mobile device demands for increased bandwidth [1]-[3]. In this paper, we discuss BVA manufacturing process details and associated demonstration test vehicle design. This prototype BVA PoP demonstrates 1020 vertical interconnects at 0.24mm pitch within an industry standard 14 × 14mm package footprint. Information regarding test vehicle design optimization, critical assembly process steps, package reliability, and testing will be discussed along with the overall high volume manufacturing (HVM) readiness of BVA.

Keywords

integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; optimisation; BVA manufacturing process; BVA technology; HVM; PoP configuration; bond via array technology; critical assembly process steps; high volume manufacturing; package footprint; package reliability; size 0.24 mm; size 14 mm; test vehicle design optimization; ultra-high bandwidth package-on-package; vertical connections; Arrays; Assembly; Prototypes; Standards; Substrates; Vehicles; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th

Conference_Location

Orlando, FL

Type

conf

DOI

10.1109/ECTC.2014.6897474

Filename

6897474