Thermal sensitivity analysis for the 119 PBGA-a framework for rapid prototyping

New package prototyping is often a sequential process where the chip and system parameters are specified first, then the package design is initiated. A reduction in overall cycle time can be affected if the events occur simultaneously. This study proposes a methodology for addressing this issue. The method is outlined in the context of prototyping the 119 plastic ball grid array (PBGA) package thermal performance. The parameters influencing performance are system, device or package based. Ranges for the “yet-to-be-fixed” parameters are determined and factorial analyses used to yield approximate linear models with interactions for package performance. Once the device and system parameters are “fixed”, the linear equations are solved simultaneously with junction and board temperature constraints to yield a design options map for package layout