Title :
Gold wire bonding onto flexible polymeric substrates
Author :
Hall, Elizabeth ; Lyons, Alan M. ; Weld, John D.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
Copper clad polymeric materials were examined as potential substrates for wire bonded chip-on-flex circuits. New thermoplastic flex and a PTFE/woven glass substrate were evaluated along with polyimides using high temperature copper laminate adhesives and adhesiveless constructions. Initial wire bond pull tests indicated all the materials were suitable for high temperature gold wire bonding. Similarly, conventional glob top encapsulants were found to adhere to each of the thirteen substrates tested; experimental UV curable glob top materials were found to adhere well to polyester and PTFE substrates, but not to polyimides or polyether imides
Keywords :
gold; lead bonding; polymers; substrates; Au; PTFE/woven glass substrate; UV curing; adherence; chip-on-flex circuit; copper laminate adhesives; flexible polymeric substrates; glob top encapsulants; high temperature gold wire bonding; polyesters; polyether imides; polyimides; pull tests; thermoplastic flex; Bonding; Circuits; Copper; Glass; Gold; Materials testing; Polyimides; Polymers; Temperature; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514366
