Title :
PCB trace thermal analysis and effective conductivity
Author :
Lemczyk, T.F. ; Mack, Benjamin ; Culham, J.R. ; Yovanovich, M.M.
Author_Institution :
Waterloo Univ., Ont., Canada
Abstract :
A two-dimensional, steady-state thermal conduction analysis is made on a finite, plane homogeneous medium (a printed circuit board, or PCB) to examine the trace behavior. The trace is modeled as a zero-thickness, strip heat source with specified uniform temperature, and its position in the medium is varied. A two-dimensional thermal analysis is also performed on a multilayered cell model with finite heat source to establish an accurate, effective thermal conductivity for a typical PCB
Keywords :
heat conduction; packaging; printed circuits; thermal analysis; thermal conductivity; 2D steady state thermal conduction analysis; PCB; finite heat source; multilayered cell model; plane homogeneous medium; printed circuit board; thermal analysis; thermal conductivity; trace behavior; zero thickness strip heat source; Copper; Electronic packaging thermal management; Microelectronics; Printed circuits; Resistance heating; Strips; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-87942-664-0
DOI :
10.1109/STHERM.1991.152906
