DocumentCode :
2353974
Title :
A high density edge connector
Author :
Campbell, J. ; Holton, J. ; Knight, A.
fYear :
1995
fDate :
21-24 May 1995
Firstpage :
140
Lastpage :
143
Abstract :
A connector using new technology concepts has been developed for high density, high performance applications that is reliable and cost effective. Molding and batch panel processing operations minimizes component fabrication costs. The modular design allows for flexibility in applications without massive tooling investments. Electrical performance supports high data transfer rates with excellent reliability at a competitive cost. Low force per contact minimizes the complexity of the force containment structures and the no contact wipe requirement simplifies the connector actuation hardware. Solderless attachment to the card results in environmentally safe assembly operations and the simple guide and actuation elements minimizes manufacturing and assembly expense
Keywords :
electric connectors; printed circuit accessories; PC card connector; batch panel processing operations; environmentally safe assembly operations; force containment structures; high data transfer rates; high density edge connector; high performance applications; modular design; molding operations; reliability; solderless attachment; Assembly; Atherosclerosis; Conductive films; Connectors; Contact resistance; Flexible electronics; Flexible printed circuits; Geometry; Impedance; Integrated circuit interconnections;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
Type :
conf
DOI :
10.1109/ECTC.1995.514374
Filename :
514374
Link To Document :
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