Title :
70 μm fine pitch wirebonding
Author :
Nguyen, L. ; Singh, I. ; Murray, C. ; Jackson, J. ; DeRosa, J. ; Ho, D.
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
As device feature dimensions get ever smaller, the industry trend is to shrink the die size for higher throughput and yield. Smaller pad size at finer pitch presents many difficulties and are unachievable with the current generation of bonders. This paper presents the highlights of a Sematech-funded effort to identify barriers to fine pitch wirebonding, and develop the necessary capabilities to achieve 70 μm in-line wirebonding on fine pitch leadframes. The program addressed the tooling, software, and hardware needed to enhance the performance of a wirebonder. The ESEC 3006 F/X wirebonder was selected for the case study. Feasibility was shown in a lab environment, and manufacturability was demonstrated under a high volume production environment
Keywords :
fine-pitch technology; integrated circuit design; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated circuit yield; lead bonding; 70 micron; ESEC 3006 F/X wirebonder; device feature dimensions; die size; fine pitch leadframes; fine pitch wirebonding; hardware; in-line wirebonding; manufacturability; pad size; process yield; software; throughput; tooling; volume production environment; wirebonder performance; Bonding; Consumer electronics; Costs; Electronic equipment manufacture; Flip chip; Hardware; Manufacturing; Packaging machines; Production; Shape; Software performance; Software tools; Throughput; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4523-1
DOI :
10.1109/IEMT.1998.731164
