DocumentCode :
2354370
Title :
Neural network-based real time thermal design expert system [packaging]
Author :
Vikram, S. ; Nguyen, L.
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
fYear :
1998
fDate :
19-21 Oct 1998
Firstpage :
443
Lastpage :
449
Abstract :
Ideally, package thermal performance should be taken into account during the package design process, and each new design would require modeling and simulation to determine package thermal performance. With current methods, this step is computationally intensive, and complete design with several iterations takes considerable time. The design process can be accelerated by more than an order of magnitude if package configuration thermal data is made available in real time. This was accomplished using a neural network-based “thermal calculator”. A thermal calculator was constructed for each package family by running simulations and varying package properties (e.g. die size, pad size, packaging material properties) parametrically throughout the package design domain. The results were used to train a neural net. Subsequent Web interfacing provided real time distributed thermal performance information. This paper discusses the thermal design expert system. TDES provides a higher level of abstraction than thermal calculators, and helps the designer by providing solutions across multiple packages. The tool provides a Web interface in order to determine user requirements. It then uses this information to query the thermal calculators for all packages, and recommends a package to the user based upon certain pre-determined heuristics. All tools have been validated to provide high accuracy, and this process has been shown to substantially improve new package design cycle time. TDES has been written entirely in C++ for easy maintainability. The TDES framework was designed to be extendable to accept other design criteria
Keywords :
circuit CAD; circuit simulation; integrated circuit packaging; intelligent design assistants; learning (artificial intelligence); neural nets; real-time systems; software tools; thermal analysis; thermal management (packaging); C++ code; TDES; TDES framework; Web interface; Web interfacing; design criteria; design iterations; design process acceleration; die size; maintainability; modeling; neural net training; neural network-based real time thermal design expert system; neural network-based thermal calculator; package configuration thermal data; package design cycle time; package design domain; package design process; package properties; package recommendation; package thermal performance; packages; packaging; packaging material properties; pad size; pre-determined heuristics; real time distributed thermal performance information; simulation; simulations; thermal calculators; thermal design expert system; user requirements; Acceleration; Biographies; Biological neural networks; Computational modeling; Design engineering; Electronic packaging thermal management; Expert systems; Libraries; Material properties; Neural networks; Packaging; Process design; Real time systems; Semiconductor device packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location :
Austin, TX
ISSN :
1089-8190
Print_ISBN :
0-7803-4523-1
Type :
conf
DOI :
10.1109/IEMT.1998.731170
Filename :
731170
Link To Document :
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