Title :
Real-time popcorn analysis of plastic ball grid array packages during solder reflow
Author :
Lau, John ; Chen, Ray ; Chang, Chris
Author_Institution :
Express Packaging Syst. Inc., Palo Alto, CA, USA
Abstract :
The time-history deformation of plastic ball grid array (PBGA) packages during solder reflow on printed circuit boards (PCB) is measured by the electrical-resistance strain gauge method. Two groups of experiments are performed, one after 24 hours at 125°C (to bake out the moisture from the package) and the other after 24 hours at 125°C, then 85°C/85RH for 168 hours (to impose a controlled moisture content into the package). The results show that for the PBGAs with moisture content, popcorning occurs not at the peak solder-reflow temperature, but at an earlier stage
Keywords :
assembling; ball grid arrays; electric resistance; heat treatment; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; moisture; plastic packaging; printed circuit manufacture; reflow soldering; strain gauges; thermal analysis; thermal stress cracking; thermal stresses; 125 C; 168 hr; 24 hr; 85 C; PBGA moisture content; PBGA packages; controlled package moisture content; electrical-resistance strain gauge method; moisture bake-out; peak solder-reflow temperature; plastic ball grid array; plastic ball grid array packages; popcorning; printed circuit boards; real-time popcorn analysis; solder reflow; time-history deformation; Capacitive sensors; Electric resistance; Electric variables measurement; Electronics packaging; Moisture; Moisture control; Plastic packaging; Printed circuits; Strain measurement; Temperature; Thermal conductivity; Thermal expansion; Thermal resistance;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4523-1
DOI :
10.1109/IEMT.1998.731172
